Structure and method to gain substantial reliability improvements in lead-free BGAs assembled with lead-bearing solders

ABSTRACT

Methods of forming and assemblies having hybrid interconnection grid arrays composed of a homogenous mixture of Pb-free solder joints and Pb-containing solder paste on corresponding sites of a printed board. The aligned Pb-free solder joints and Pb-containing solders are heated to a temperature above a melting point of the Pb-free solder joint for a sufficient time to allow complete melting of both the Pb-free solder joints and Pb-containing solder paste and the homogenous mixing thereof during assembly. These molten materials mix together such that the Pb from the Pb-containing solder disperses throughout substantially the entire Pb-free solder joint for complete homogenization of the molten materials to form the homogenous hybrid interconnect structures of the invention.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to the manufacture of electronic modules,and in particular, to methods of attaching electronic components to eachother using Pb-free solder interconnections in combination with Sn/Pb orPb-containing paste to provide a soldered article with acceptable andreliable levels of thermo-mechanical fatigue.

2. Description of Related Art

The use of solder to join materials such as components of an electronicstructure is well known in the art. In the electronics area there are amyriad of electronic components that require connection to otherelectronic components or to other levels of packaging. Examples includemounting of integrated circuit chips to a metallized substrate,multi-layer ceramic substrate (MLC), laminate organic substrate, glassceramic substrate, card (direct-chip-attach, DCA), printed circuit board(PCB) and any substrate made of composite materials meeting thermal andmechanical properties.

Conventionally, Sn—Pb type solder interconnections, having low tensilemodulus, are used to join electronic components, such as substrates toelectronic PCBs or cards. However, since these Sn—Pb type solderinterconnections contain poisonous Pb, there has been an increasingnumber of cases in which the use thereof is restricted. To address theseproblems, trends have been leaning towards the use of interconnectionscomposed of Pb-free solders for joining substrates to electronic PCBs.Several Pb-free solders have been identified for replacing Pb-containingsolder interconnections in microelectronic applications, some of whichinclude Sn-3.5Ag (SA), Sn-3.5Ag-0.7Cu (SAC), Sn-3.5Ag-4.8Bi (SAB), andSn-0.7Cu (SC) (with slight variations in compositions).

As the interconnect industry diverges away from the use of Sn—Pb typesolder interconnections, and towards Pb-free interconnections, thereremains a period during which the use of a Sn—Pb type solder paste (orflux) will still be required for joining the Pb-free interconnections tothe electronic PCBs due to the materials thereof. However, attempts atattaining a sufficient and acceptable level of thermo-mechanical fatiguereliability for these hybrid or mixed assemblies has not generally beensuccessful.

Accordingly, during this interim period, there exists a need in the artfor providing improved methods for connecting Pb-free interconnectionsto electronic PCBs using a Sn—Pb type solder paste (or flux) for forminga soldered article having superior reliability in the mixed (hybrid)assembly.

SUMMARY OF THE INVENTION

Bearing in mind the problems and deficiencies of the prior art, it istherefore an object of the present invention to provide methods forconnecting Pb-free interconnections to electronic PCBs using aPb-containing solder.

It is another object of the present invention to provide a solderedarticle having superior reliability at a soldered mixture of a Pb-freeinterconnections and a Pb-containing solder.

A further object of the invention is to provide methods for making, andthe soldered articles formed, having hybrid interconnects withacceptable and reliable levels of thermo-mechanical fatigue.

It is yet another object of the present invention to provide methods ofmaking soldered articles having reliable hybrid interconnects in aneasy, efficient and inexpensive manner.

Still other objects and advantages of the invention will in part beobvious and will in part be apparent from the specification.

The above and other objects, which will be apparent to those skilled inart, are achieved in the present invention, which is directed to amethod of forming an interconnect structure by providing a lead freesolder joint, providing a lead-containing solder and then aligning thelead free solder joint with the lead-containing solder. The aligned leadfree solder joint and lead-containing solder are heated to a temperatureabove a melting point of the lead free solder joint for a sufficienttime to allow for complete homogenization of the lead free solder jointwith the lead-containing solder. This forms a homogenous hybridinterconnect structure of the invention.

In the invention, the lead free solder joint may be a solder ball or asolder column, and may be compose of a material including, but notlimited to, Sn—Ag (SA), Sn—Ag—Sb, Sn—Ag—Bi, Sn—Ag—Cu (SAC), Sn—Ag—Cu—Sb,Sn—Ag—Cu—Bi, Sn—Ag—Bi—Sb, Sn—Cu (SC), Sn—Cu—Sb, Sn—Cu—Bi andcombinations thereof. Alternatively, the lead free solder joint may becompose of a material including, but not limited to, Sn—Zn, Sn-Zi-Bi,Sn—In, Sn—Bi, Sn—Ag—In, Sn—Ag—In—Cu or combinations thereof. Thelead-containing solder may be a lead-containing solder paste, alead-containing solder paste with organic flux, or a lead-containingsolder paste without organic flux. For example, the lead-containingsolder may be a tin-lead paste

In forming the homogenous hybrid interconnect structure of theinvention, the aligned lead free solder joint and lead-containing soldermaybe heated to temperatures ranging from above 217° C. to about 260°C., and times ranging from about 2 minutes to about 4 minutes. Thehomogenous hybrid interconnect structure may have a configurationcharacterized by having no distinct regions of the lead free solderjoint and the lead-containing solder.

In another aspect, the invention is directed to a method of forming aninterconnection grid array structure by providing an interconnectiongrid array of lead free solder joints and an array of lead-containingsolder. The array of lead-containing solder corresponds to theinterconnection grid array of lead free solder joints. The array oflead-containing solder and the interconnection grid array of lead freesolder joints are aligned and then heated. In so doing, these componentsare heated to a temperature above a melting point of the lead freesolder joints for a sufficient time to allow for complete melting andmixing together of both the interconnection grid array of lead freesolder joints and the array of lead-containing solder such that the leadfrom the lead-containing solder disperses throughout the interconnectiongrid array of lead free solder joints. This forms the homogenous hybridinterconnect grid array of the invention that has both improved andreliable levels of thermo-mechanical fatigue.

In still another aspect, the invention is directed to an assembly havingan interconnection grid array that includes a first substrate joined toa second substrate via a homogenous hybrid interconnect grid array. Thehomogenous hybrid interconnect grid array has a plurality of hybridsolder joints. Each of these hybrid solder joints is composed of ahomogenous mixture of a lead free solder and a lead-containing solder,whereby the homogenous hybrid interconnect grid array has improved,reliable levels of thermo-mechanical fatigue.

BRIEF DESCRIPTION OF THE DRAWINGS

The features of the invention believed to be novel and the elementscharacteristic of the invention are set forth with particularity in theappended claims. The figures are for illustration purposes only and arenot drawn to scale. The invention itself, however, both as toorganization and method of operation, may best be understood byreference to the detailed description which follows taken in conjunctionwith the accompanying drawings in which:

FIG. 1 illustrates a first substrate having a Pb-free solderinterconnection grid array attached thereto in alignment withPb-containing solder residing on a second substrate.

FIG. 2 illustrates the structure of FIG. 1 processed in accordance withthe invention to provide a homogenous hybrid interconnect structure ofthe invention.

FIG. 3 illustrates an exploded view of FIG. 2 showing the homogenoushybrid interconnect structure of the invention.

FIG. 4 is a prior art illustration showing the structure of FIG. 1processed in accordance with conventional processing techniques toresult in a prior art interconnect structure.

DESCRIPTION OF THE PREFERRED EMBODIMENT(S)

In describing the preferred embodiment of the present invention,reference will be made herein to the drawings in which like numeralsrefer to like features of the invention.

The present invention is directed to providing methods of forminghomogenous hybrid interconnect structures, and the interconnectstructures formed, that have acceptable and reliable levels ofthermo-mechanical fatigue. In particular, the invention discloseshomogenous hybrid interconnect structures, and methods of forming suchhybrid interconnect structures using Pb-free solder joints and aPb-containing solder for joining a substrate to an electronic circuitboard. The invention requires the combination of adequate thermal energywith adequate dwell times for forming these homogenous hybridinterconnect structures.

Referring to FIG. 1, a substrate 10 of an electronic module is shownhaving attached thereto a solder interconnection grid array 20. Thesolder joints 25 of the interconnection grid array are composed ofPb-free solders including, but not limited to, Sn—Ag (SA), Sn—Ag—Sb,Sn—Ag—Bi, Sn—Ag—Cu (SAC), Sn—Ag—Cu—Sb, Sn—Ag—Cu—Bi, Sn—Ag—Bi—Sb, Sn—Cu(SC), Sn—Cu—Sb, Sn—Cu—Bi, Sn—Ag—Cu—Sb—Bi and combinations thereof, whichmelt at temperatures ranging from about 217° C. to about 260° C. ThesePb-free alloy solder compositions vary in concentrations, such as forexample, Sn-3.5Ag, Sn-3.5Ag-0.7Cu, 95.5Sn-3.8Ag-0.7Cu, Sn-3.5Ag-4.8Bi,Sn-0.7Cu or some other alloy combination. Alternatively, the solderjoints 25 may be composed of materials that melt at temperatures rangingfrom about 175° C. to about 260° C. including, but not limited to,Sn—Zn, Sn-Zi-Bi, Sn—In, Sn—Bi, Sn—Ag—In, Sn—Ag—In—Cu or combinationsthereof. The Pb-free solders are preferably high melting point Pb-freesolders. In accordance with the invention, the solder joints 25 mayinclude solder ball grid arrays (BGA), solder column grid arrays, (CGA),and the like. For ease of understanding, solder BGAs are used and shownin the drawings to describe the present invention.

Once the Pb-free alloy solder joints 25 are attached to the substrate, aPb-containing solder 30, which may be a paste with or without an organicflux, is provided on a printed circuit board 40 by known techniques inlocations corresponding to where the solder joints 25 are to be joinedto the board, such as on I/O pads. The Pb-containing solder 30 may beeither a eutectic Pb-containing solder 30 or a non-eutecticPb-containing solder 30. Preferably, the Pb-containing solder 30includes, but is not limited to, a Sn/Pb paste, a eutectic Sn/Pb paste,and the like. The substrate 10 and board 40 are then aligned such thatthe each of the Pb-free alloy solder joints 25 are directly over andaligned to the corresponding Pb-containing solder 30 residing on theboard.

The assembly is then provided within a furnace for heating the Pb-freealloy solder joints 25 and Pb-containing solder 30 at elevatedtemperatures and extended times to provide the soldered assembly of theinvention having hybrid interconnects with acceptable and reliablelevels of thermo-mechanical fatigue. In so doing, the assembly isprovided within a preheated chamber. A critical component of theinvention is that the assembly is then heated at a sufficienttemperature for a sufficient dwell time that allows the Pb-free alloysolder joints and the Pb-containing solder to homogenize together suchthat a hybrid, uniform interconnect 60 is formed, as shown in FIG. 2. Inachieving the homogenized interconnect structure of the invention, anessential feature is that the assembly be heated to temperatures thatare above the melting point of the Pb-free solder joints 25.

In the preferred embodiment, the assembly includes Pb-free solder ballson the substrate that are in alignment with Sn—Pb solder on a board. Theassembly is provided within a furnace preheated to temperatures rangingfrom at least or above 217° C. to about 260° C. A critical component ofthe invention is that the assembly is then continuously heated at thesetemperatures ranging from at least or above 217° C. to about 260° C.,preferably at about 220° C. to about 240° C., for a time ranging from atleast or above 1 minute to about 4 minutes, preferably from about 2minutes to about 4 minutes. Shorter dwell times may be used inaccordance with the invention, such as dwell times ranging from about 30seconds to about 1 minute, wherein the heating conditions of theprocessing chamber are optimal and the heating of the assembly issubstantially uniform throughout. Also, temperature ranges higher than240° C. may be used, but are ultimately dependent upon the various othercomponents that make up the electronic assembly. For example, astemperatures above 240° C. may have disastrous effects on plasticcomponents, it is preferred that the heating temperatures not exceed240° C. in such instances. However, if one desires to re-qualify orreplace any components destroyed during the process of heating theassembly, temperatures may exceed 240° C.

Referring to FIGS. 2 and 3, in accordance with the invention, it is thecombination of the higher temperatures, i.e., temperatures ranging fromat least or above 217° C. to about 260° C., and longer dwell times,i.e., times ranging from above 1 minute to about 4 minutes, preferablyfrom about 2-4 minutes, that advantageously provide the beneficialresults of the invention. In particular, this combination enables thePb-free solder and the Sn—Pb solder to completely homogenize together toprovide hybrid interconnect structures 60, or joints, that no longerhave apparent metallurgical separation zones between the Pb-free solderball and Sn—Pb solder. That is, the present hybrid interconnectstructures 60 are characterized by having no distinct fillets of theSn—Pb solder or regions of the Pb-free solder ball and Sn—Pb solder.Rather, as is shown in FIGS. 2 and 3, the hybrid interconnect structures60 are a single, uniform interconnect having a substantially oblateellipsoid configuration. These homogenized interconnect structures havea substantially barrel-like shape with outwardly curved sides withportions of both the tops and bottoms removed to provide these hybridinterconnects with substantially flattened poles (oblate).

The final shape of the hybrid joint 60 may be manipulated by use ofstand-offs, which may be placed between the substrate and the board, orby other means. However, the hybrid joint 60 will still be characterizedby having no distinct fillets of the Sn/Pb solder. Rather, the jointwill have a homogenized structure with no separate zones of Pb-freesolder and Sn—Pb solder. Wherein the Pb-free alloy solder joints 25comprise columns and the like, complete homogenization in accordancewith the invention also results in the single, homogeneous hybridinterconnect structures 60 with substantially oblate ellipsoid shapes asshown in FIG. 2.

In achieving the oblate ellipsoid hybrid interconnect structures of theinvention, it has advantageously been found that by heating the Pb-freesolder interconnect and the Sn—Pb solder to temperatures just above themelting point of the Pb-free solder interconnect for sufficiently longdwell times, i.e., to at least or above 220° C. to about 240° C. forabove 1 minute to about 4 minutes, preferably from about 2-4 minutes,both the Pb-free solder ball and the Pb-containing solder residing onthe board are allowed to completely melting during assembly. As is shownin FIG. 3, these molten materials mix together such that the Pb from thePb-containing solder disperses throughout substantially the entirePb-free solder interconnect for complete homogenization of the moltenmaterials to from the uniform hybrid interconnect structures 60 of theinvention. For example, wherein the Pb-free solder interconnect joint isa 1 mm pitch SAC CBGA, with a density close to that of pure Sn, and thePb-containing solder is a 60Sn-40Pb solder, the Pb from the 60Sn-40Pbsolder disperses throughout the structure to result in a homogenoushybrid interconnect structure of the invention having about 6% by weightPb.

The single, homogeneous hybrid interconnect structures of the inventionhave significantly improved reliability levels under the influence ofthermo-mechanical strains, as compared to the prior art structures, asshown in FIG. 4. The present homogeneous hybrid interconnect structuresalso discourage crack nucleation and growth at an early stage at theboard side of the solder interconnection, which in turn leads to asignificantly improved useful life of the electronic module, as measuredby cycles to failure.

In comparison, FIG. 4 shows the results of a conventional prior artapproach at joining Pb-free solder interconnects to a board using Sn—Pbpaste have been dictated by the melting points of the Sn—Pb paste, andas such, are normally carried out at temperatures of about 195-215° C.,typically about 205° C., for a dwell time of about 15 seconds to about 1minute. However, at these temperatures and dwell times, only the Sn—Pbpaste melts, not the Pb-free solder interconnects, such that theinterconnection joints remain sufficiently tall, but with extremely poorjoints characterized by unacceptable and unreliable levels ofthermo-mechanical fatigue. The resultant prior art interconnectstructure illustrates that, under these conventional processingconditions, apparent metallurgical separation zones or distinct filletsexist between the Pb-free solder ball and Sn—Pb solder. It is thesedistinct fillet zones of Sn—Pb solder that makes such an interconnectstructure weak and unable to withstand stresses during thermal cycling.Further, in conventional processing, even if processing temperatures areslightly higher than 217° C. (e.g. 220° C.) at dwell times of about 15seconds to about 75 seconds, there is no guarantee that all the jointswill homogenize adequately. Incomplete homogenization results in anunreliable structure. It has now been found that processing conditionsmust be specified such that there is a guarantee of completehomogenization of all interconnects (joints) in the structure. Thisincludes specific processing conditions for both heating temperatures incombination with dwell times, as is set forth in the foregoinginvention.

Based on the Coffin-Manson equation a higher joint height translates tohigher reliability under the influence of thermo-mechanical strain.Since it was believed that a non-melting Pb-free ball would provide ahigher joint height, conventional practice has been to avoid melting ofthe Pb-free solder interconnect joint. The present invention has foundthe unexpected results that by heating these Pb-free solder interconnectjoints to temperatures just above the melting point of the Pb-freematerial for adequate times, both the Pb-free solder and thePb-containing paste melt, homogenize together and from a homogenoushybrid interconnect structure having significantly improved durabilityand reliability during performance of the electronic module.

The below experimental results show the improved results of theinterconnect structures of the present invention, as shown in FIG. 2,which can achieve about 879 ATC cycles to failure at normal workingcondition temperatures of about 0° C. to about 100° C., as compared tothe convention interconnect structures of the prior art, as shown inFIG. 4, which can only achieve about 400 ATC cycles under the sameworking conditions.

Number of Samples Peak Reflow Dwell Time Above Average Life ProcessedTemperature 183° C. (ATC) 4 203° C. 3.5 minutes 400 cycles 4 220° C. 3.5minutes 879 cycles

Accordingly, the present invention provides methods of making and thehomogenous hybrid interconnect structures made having at least, or morethan, twice the useful lifetime (fatigue life) as compared toconventional interconnect structures having a distinct fillet ofPb-containing solder attached to a Pb-free solder.

While the present invention has been particularly described, inconjunction with a specific preferred embodiment, it is evident thatmany alternatives, modifications and variations will be apparent tothose skilled in the art in light of the foregoing description. It istherefore contemplated that the appended claims will embrace any suchalternatives, modifications and variations as falling within the truescope and spirit of the present invention.

1. An assembly having an interconnect structure comprising: a firstsubstrate; a second substrate; and a homogenous hybrid interconnectstructure joining said first and second substrates, said homogenoushybrid interconnect structure comprising a hybrid solder joint composedof a homogenous mixture of a lead free solder and a lead-containingsolder to form a homogenous hybrid solder joint, whereby said homogenoushybrid solder joint has improved, reliable levels of thermo-mechanicalfatigue.
 2. The assembly of claim 1 wherein said lead-containing soldercomprises a tin-lead paste.
 3. The assembly of claim 1 wherein saidhomogenous hybrid solder joint has a configuration characterized byhaving no distinct region of said lead free solder and saidlead-containing solder.
 4. The assembly of claim 1 wherein said leadfree solder comprises a material selected from the group consisting ofSn—Ag (SA), Sn—Ag—Sb, Sn—Ag—Bi, Sn—Ag—Cu (SAC), Sn—Ag—Cu—Sb,Sn—Ag—Cu—Bi, Sn—Ag—Bi—Sb, Sn—Cu (SC), Sn—Cu—Sb, Sn—Cu—Bi, Sn—Ag—Cu—Sb—Bior combinations thereof.
 5. The assembly of claim 1 wherein said leadfree solder comprises a material selected from the group consisting ofSn—Zn, Sn—Zi—Bi, Sn—In, Sn—Bi, Sn—Ag—In, Sn—Ag—In—Cu or combinationsthereof.
 6. The assembly of claim 1 wherein said lead-containing solderis selected from the group consisting of a lead-containing solder paste,a lead-containing solder paste with organic flux, or a lead-containingsolder paste without organic flux.
 7. The assembly of claim 1 whereinsaid homogenous hybrid solder join is configured with substantiallyoblate ellipsoid shape.
 8. An assembly having an interconnection gridarray comprising: a first substrate; a second substrate; and ahomogenous hybrid interconnect grid array joining said first and secondsubstrates, said homogenous hybrid interconnect grid array having aplurality of hybrid solder joints each composed of a homogenous mixtureof a lead free solder and a lead-containing solder, whereby saidhomogenous hybrid interconnect grid array has improved, reliable levelsof thermo-mechanical fatigue.
 9. The assembly of claim 8 wherein saidhomogenous hybrid solder joints having configurations characterized byhaving no distinct region of said lead free solder and saidlead-containing solder.
 10. The assembly of claim 8 wherein said leadfree solder comprises a material selected from the group consisting ofSn—Ag, Sn—Ag—Sb, Sn—Ag—Bi, Sn—Ag—Cu, Sn—Ag—Cu—Sb, Sn—Ag—Cu—Bi, Sn—Ag—Bi,Sn—Ag—Bi—Sb, Sn—Cu, Sn—Cu—Sb, Sn—Cu—Bi or combinations thereof.
 11. Theassembly of claim 8 wherein said lead free solder comprises a materialselected from the group consisting of Sn—Zn, Sn—Zi—Bi, Sn—In, Sn—Bi,Sn—Ag—In, Sn—Ag—In—Cu or combinations thereof.
 12. The assembly of claim8 wherein said lead-containing solder is selected from the groupconsisting of an array of lead-containing solder paste, an array oflead-containing solder paste with organic flux, or an array oflead-containing solder paste without organic flux.
 13. The assembly ofclaim 8 wherein said lead-containing solder comprises a tin-lead paste.14. The assembly of claim 8 wherein said configurations of saidplurality of hybrid solder joints are substantially oblate ellipsoidshapes.
 15. An assembly having an interconnection grid array structurecomprising: a first substrate; a second substrate; and a homogenoushybrid interconnect grid array joining said first and second substrates,said homogenous hybrid interconnect grid array having a plurality ofhybrid solder joints being substantially oblate ellipsoid shaped andeach composed of a homogenous mixture of a lead free solder and alead-containing solder to form a homogenous hybrid interconnect gridarray having improved, reliable levels of thermo-mechanical fatigue andcharacterized by having no distinct regions of said lead free solderjoint and said lead-containing solder.
 16. The assembly of claim 15wherein said lead free solder comprises a material selected from thegroup consisting of Sn—Ag, Sn—Ag—Sb, Sn—Ag—Bi, Sn—Ag—Cu, Sn—Ag—Cu—Sb,Sn—Ag—Cu—Bi, Sn—Ag—Bi, Sn—Ag—Bi—Sb, Sn—Cu, Sn—Cu—Sb, Sn—Cu—Bi orcombinations thereof.
 17. The assembly of claim 15 wherein said leadfree solder comprises a material selected from the group consisting ofSn—Zn, Sn—Zi—Bi, Sn—In, Sn—Bi, Sn—Ag—In, Sn—Ag—In—Cu or combinationsthereof.
 18. The assembly of claim 15 wherein said lead-containingsolder is selected from the group consisting of an array oflead-containing solder paste, an array of lead-containing solder pastewith organic flux, or an array of lead-containing solder paste withoutorganic flux.
 19. The assembly of claim 15 wherein said lead-containingsolder comprises a tin-lead paste.
 20. The assembly of claim 15 whereina first material of the lead free solder and a second material of thelead-containing solder are dispersed throughout the plurality of hybridsolder joints to provide said homogenous hybrid interconnect grid array.